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Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
*Customer :
Specification
SWT805-S
CUSTOMER Checked by Approved by
SUPPLIER Drawn by Approved by
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Contents
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. Description Absolute Maximum Ratings Electro Characteristics Optical characteristics Reliability Test Item and Condition Color & Binning Material Outline Dimension Packing Soldering Precaution for use Handling of Silicone Resin LEDs
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Revision History
Revision No.
00
Date
October. 23. 2008
Page.
Initial release
Summary
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Technical Data Sheet
SWT805-S
1. Description This surface-mount LED comes in standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40 to 100. The high reliability feature is crucial to Automotive interior and Indoor ESS.
Features
* White colored SMT package * InGaN/Sic material * Suitable for all SMT assembly and soldering methods * Pb-Free Reflow soldering application * RoHS compliant
Applications
* White Back-light unit * Electric Signs and Signals * Interior automotive * Office Automation, Electrical Appliances, Industrial Equipment
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
2. Absolute maximum ratings*1
Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Symbol Pd IF IFM
*2
Value 120 30 90 5 -40 ~ +85 -40 ~ +100
Unit mW mA mA V C C
VR Topr Tstg
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW 1msec of pulse width and D 1/10 of duty ratio.
3. Electric characteristics
Parameter Forward Voltage*1 Reverse Current Luminous Intensity*2 Luminous flux Viewing Angle
*3
Symb ol VF IR IV
Condition IF =20mA VR=5V IF =20mA IF =20mA
Min 2.9 1,400
Typ 3.2 1,900 4.75
Max 3.4 10 2,500
Unit V A mcd lm
2
1/2
IF =20mA
-
115
-
deg.
*1.Forward Voltage Measurement allowance is 0.1V *2.The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is 7% *3.21/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. *4 Estimated time to 50% degradation of initial luminous intensity.
[Note] All measurements were made under the standardized environment of SSC.
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
Relative Luminous Intensity [%]
Forward Current IF [mA]
Forward Current IF [mA]
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
4. Optical characteristics
Forward Current vs. Forward Voltage
(Ta=25 OC )
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 10 20 30 40
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
10
1
10
0
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
4.2
Forward Voltage VF (V)
Forward Current IF [mA]
Forward Current Derating Curve
(Ta=25 OC )
40
Radiation Diagram
0 -30
30
30
20
-60
60
10
-90
0 -40 -20 0 20 40 60
O
90
80
100
120
Ambient Temperature TA [ C]
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
5. Reliability Test
Item Thermal Shock Temperature Cycle High Temperature Storage High Temperature High Humidity Storage Low Temperature Storage Operating Endurance Test High Temperature / Humidity Life High Temperature Life Test Low Temperature Life Test ESD(HBM) Reference Internal Reference EIAJ ED-4701 EIAJ ED-4701 Test Condition Ta =-40oC (30MIN) ~ 100oC (30MIN) Ta =-40oC (30MIN) ~ 25oC (5MIN) ~ 100oC (30MIN) ~ 25oC (5MIN) Ta =100oC Ta =85oC, RH=85% Ta =-40oC Ta =25oC, IF =20mA Ta =60oC, RH=90%, IF =20mA Ta =60oC, IF =20mA Ta =-40oC, IF =20mA 1KV at 1.5k; 100pF Duration / Cycle 100 Cycle 100 Cycle 1,000 Hours Number of Damage 0/22 0/22 0/22
EIAJ ED-4701
1,000 Hours
0/22
EIAJ ED-4701 Internal Reference Internal Reference Internal Reference Internal Reference MIL-STD883D
1,000 Hours 1,000 Hours 1,000 Hours 1,000 Hours 1,000 Hours 3 Time
0/22 0/22 0/22 0/22 0/22 0/22
* Criteria for Judging the Damage
Item Forward Voltage Reverse Current Luminous Intensity Symbol VF IR IV Condition IF =20mA VR=5V IF =20mA Criteria for Judgement MIN LSL*2 x 0.7 MAX USL*1 x 1.1 100 A -
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
*ESD guarantee condition
Item HBM Test Condition 1,000 V Criteria for Judgement IR =100 and below Test Form CONTACT
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
CIE (y)
y coords.
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
6. Color Coordinate & Bin Code Description
0.9
520
0.8
510
525 530 535 540 545 550 555 560 565 570
515
0.7
505
0.6
500
0.5 0.4 0.3 0.2 0.1 0.0 0.0
495
575 580 585 590 595 600
610 620 490 630 830
485
480
475 470 460
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
C I E (x)
0.36
6300K
0.34 0.32 0.30 0.28 0.26 0.24 0.22
M0 M1 7000K M2 L1 K0 M3 L2 7500K K1 J0 M4 L3 8000K K2 J1 M5 I0 L4 K3 J2 8400K I1 H0 L5 K4 J3 8900K I2 H1 K5 G0 J4 I3 H2 G1 9900K F0 J5 I4 H3 G2 10800K F1 I5 H4 E0 G3 F2 E1 13000K H5 G4 D0 F3 E2 G5 D1 15000K F4 E3 C0 D2 F5 E4 C1 20000 K D3 B0 E5 C2 D4 B1 30000 K C3 A0 D5 B2 C4 A1 B3 C5 A2 B4 A3 B5 A4 A5
6700K
6500K
L0
CCT
Rev. 00
0.25
0.26
0.27
0.28
0.29
0.30
0.31
0.32 January, 2009 0.33
www.acriche.com www.acriche.com
x coords.
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
*CIE RANK
E3 y 0.2720 0.2670 0.2743 0.2795 x 0.2850 0.2880 0.2920 0.2893 F3 y 0.2795 0.2743 0.2815 0.2870 x 0.2893 0.2920 0.2960 0.2935 G3 y 0.2870 0.2815 0.2885 0.2940 x 0.2935 0.2960 0.3000 0.2975 H3 y 0.2940 0.2885 0.2955 0.3010 x 0.2975 0.3000 0.3040 0.3015 y 0.2885 0.2830 0.2900 0.2955 x 0.3000 0.3025 0.3065 0.3040 y 0.2815 0.2760 0.2830 0.2885 x 0.2960 0.2985 0.3025 0.3000 H4 y 0.2830 0.2775 0.2845 0.2900 Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) y 0.2743 0.2690 0.2760 0.2815 x 0.2920 0.2948 0.2985 0.2960 G4 y 0.2760 0.2705 0.2775 0.2830 y 0.2670 0.2620 0.2690 0.2743 x 0.2880 0.2910 0.2948 0.2920 F4 y 0.2690 0.2638 0.2705 0.2760 E4 y 0.2620 0.2570 0.2638 0.2690
E2 x 0.2820 0.2850 0.2893 0.2865 F2 x 0.2865 0.2893 0.2935 0.2910 G2 x 0.2910 0.2935 0.2975 0.2950 H2 x 0.2950 0.2975 0.3015 0.2990
*Measurement Uncertainty of the Color Coordinates : 0.007
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
*CIE RANK
I3 y 0.3010 0.2955 0.3025 0.3080 x 0.3015 0.3040 0.3080 0.3055 J3 y 0.3080 0.3025 0.3095 0.3150 x 0.3055 0.3080 0.3120 0.3095 K3 y 0.3150 0.3095 0.3165 0.3220 x 0.3095 0.3120 0.3160 0.3135 L3 y 0.3220 0.3165 0.3235 0.3290 x 0.3135 0.3160 0.3200 0.3175 y 0.3165 0.3110 0.3180 0.3235 x 0.3160 0.3185 0.3225 0.3200 y 0.3095 0.3040 0.3110 0.3165 x 0.3120 0.3145 0.3185 0.3160 L4 y 0.3110 0.3055 0.3125 0.3180 Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00) y 0.3025 0.2970 0.3040 0.3095 x 0.3080 0.3105 0.3145 0.3120 K4 y 0.3040 0.2985 0.3055 0.3110 y 0.2955 0.2900 0.2970 0.3025 x 0.3040 0.3065 0.3105 0.3080 J4 y 0.2970 0.2915 0.2985 0.3040 I4 y 0.2900 0.2845 0.2915 0.2970
I2 x 0.2990 0.3015 0.3055 0.3030 J2 x 0.3030 0.3055 0.3095 0.3070 K2 x 0.3070 0.3095 0.3135 0.3110 L2 x 0.3110 0.3135 0.3175 0.3150
*Measurement Uncertainty of the Color Coordinates : 0.007
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Bin Code J6 J7 J8 K9 K0 K1 K2
Bin Code Description Part Number : SWT805 - S
Bin Code Luminous Intensity J6 CIE EX Forward Voltage Z
Luminous Intensity (mcd) @ IF = 20mA Min. 1,600 1,700 1,800 1,900 2,000 2,100 2,200 Max. 1,700 1,800 1,900 2,000 2,100 2,200 2,300
Color Rank @ IF = 20mA A0~M0 A1~M1 A2~M2 A3~M3 A4~M4 A5~M5
Forward Voltage (V) @ IF = 20mA Bin Code Z Min. 2.9 Max. 3.4
7. Material
item Material Reflector PPA Wire Gold Encapsulate Silicone Chip SiC
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
3.0
0.75
1.5
3.0
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
8. Outline Dimension
2.0 2.0 0.75 1.3
Anode
Cathode
( Tolerance: 0.2 mm )
Recommended Solder Pattern
Management of Molding surface
( Tolerance:+ 0, - 0.1 mm )
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
30
10
22
60
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
9. packing
11.4 0.1 180 +0 -3 2.0 0.2
LABLE 13 0.2
9.0 0.3
( Tolerance: 0.2, Unit: mm )
(1) Quantity : 2,000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 00
January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
Reel Packing Structure
Reel
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
TYPE 7inch
SIZE (mm) c a b 245 220 102 245 220 142
1 SIDE
TUV
c
MADE IN KOREA
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Acriche
RoHS
1
Semiconductor EcoLight
b
a
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
10. soldering
(1) Lead Solder
Lead Solder
Lead Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 120~150 120 sec. Max. 240 Max. 10 sec. Max.
2.5~5 C / sec.
2.5~5 o C / sec. Pre-heating 120~150 oC
240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
Lead Free Solder Pre-heat Pre-heat time Peak-Temperature Soldering time Condition 150~200 120 sec. Max. 260 Max. 10 sec. Max.
1~5 o C / sec.
1~5 o C / sec. Pre-heating 150~200 o C
260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC
120sec. Max.
(3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315C under soldering iron.
(4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don't guarantee the products.
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
11. precaution for use
(1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5C ~30C Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40C Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 605C. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice.
Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet
12. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED's reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 00 January, 2009 www.acriche.com www.acriche.com Document No. : SSC-QP-7-07-24 (Rev.00)

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